From France precision technology to create industry-leading cutting strength

In the global high-end manufacturing sector, France is renowned for its rigorous technical standards and innovative design concepts. This chip slicer, which combines the essence of French industry, is the key production equipment for the semiconductor and electronic component processing industry. Its core components are polished by international first-class technology, combined with high-precision sensing system and stable power transmission mechanism, to build an operation miracle that can complete accurate cutting at microscopic scale.

whether it is ultra-thin silicon wafer, ceramic substrate or other hard and brittle materials, this equipment can carry out high-speed separation processing with extremely high repeated positioning accuracy, and the error is controlled within micron level, which fully meets the requirements of current high-level packaging technology for device refinement.

Automatic Operation Enabling Production Process Efficiency Improvement and Cost Reduction in One Step

In the face of increasingly fierce market competition, more and more companies are seeking automated transformation solutions to optimize resource allocation and reduce costs. This chip slicer is specially tailored for intelligent factories, equipped with advanced touch screen interface and one-key start program, so that operators can quickly grasp the function settings and complete parameter adjustment in a short time.

In addition, the machine has a self-learning algorithm model that continuously optimizes the path planning logic based on historical data; it also supports long-term continuous operation mode switching, significantly increasing the level of production per unit of time. This highly integrated design greatly reduces the chance of human error and frees up human resources for more valuable tasks.

Flexible scalable architecture design meets diverse industrial application requirements

In order to better serve different production process chains, this series of products adopts an open structure frame and a combination of modular components. Users can select the corresponding power level of the spindle motor and tool specifications according to their respective product types, so as to realize the effective separation of various wafers from the minimum 0.1mm to the maximum 300mm diameter.

more importantly, the whole system has reserved a wealth of interface space for subsequent installation of auxiliary devices-such as automatic feeders, laser rangefinders or dust removal and purification units and other peripheral accessories can be seamlessly integrated into the existing platform operation system. This flexibility advantage makes it not only suitable for the needs of traditional IC packaging and testing workshops, but also fully capable of meeting the stringent requirements of emerging LED lighting modules, MEMS sensors and other cutting-edge high-tech products.

One-stop service system builds a secure after-sales guarantee matrix

quality products can not be separated from the perfect service. To this end, we have established a professional technical support team composed of senior engineers, and set up service center sites in many key cities across the country to ensure that we can respond to customer demand feedback in the first time.

No matter what stage you are in-initial selection consultation, mid-term installation training or later operation and maintenance, we will escort you to provide all-round assistance. Not only that, all factory equipment has undergone strict quality inspection tests and comes with a detailed user manual package to help customers quickly enter a virtuous cycle of efficient production.